Double Side Treated Copper Foil Pou HDI
●Epesè: 12um 18um 35um 70um
●Creole Lajè: 1290mm, Nou ka koupe kòm kondisyon gwosè
●ID: 76 mm, 152 mm
●Longè: Customized
●Egzanp yo ka bay;Tan plon: 7 jou
●Tan livrezon: 15-20 jou
●Anbalaj detay: ekspòtasyon bwat an bwa
●Tèm: FOB, CIF.
●Atik peman: 50% T/T depo, balans peye anvan anbake.
●Ekipman jete pwosesis segondè pèfòmans fè pwosesis fabwikasyon nan papye kwiv.
●Double-bò trete papye Copper
●Avèk gwo fòs obligatwa Plastifye
●Dirèk milti-kouch laminasyon
●Bon etchability
●Foil trete a woz
●Plizyè kouch sikwi enprime
●HDI (High Density Interconnector) pou PCB
| Klasifikasyon | Inite | Egzijans | Metòd tès | ||||||
| Deziyasyon FOIL |
| T | H | 1 | 2 | IPC-4562A | |||
| Epesè nominal | um | 12 | 18 | 35 | 70 | IPC-4562A | |||
| Pwa Zòn | g/m² | 107±5 | 153±7 | 285± 10 | 585± 20 | IPC-TM-650 2.2.12 | |||
| Pite | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
| Rroughness | Bò klere (Ra) | um | ≤3.0 | IPC-TM-650 2.2.17 | |||||
| Bò mat (Rz) | um | ≤6 | ≤8 | ≤10 | ≤15 | ||||
| Fòs rupture | RT (23°C) | Mpa | ≥207 | ≥207 | ≥276 | ≥276 | IPC-TM-650 2.4.18 | ||
| H.T.(180°C) | ≥103 | ≥103 | ≥138 | ≥138 | |||||
| Elongasyon | RT (23°C) | % | ≥2 | ≥2 | ≥3 | ≥3 | IPC-TM-650 2.4.18 | ||
| H.T.(180°C) | ≥2 | ≥2 | ≥2 | ≥3 | |||||
| Rezistivite | Ωg/m² | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | IPC-TM-650 2.5.14 | |||
| Peel fòs (FR-4) | bò S | N/mm | ≥0.9 | ≥0.9 | ≥1.4 | ≥1.4 | IPC-TM-650 2.4.8 | ||
| Lbs/pous | ≥5.1 | ≥6.3 | ≥8.0 | ≥8.0 | |||||
| bò M | N/mm | ≥0.9 | ≥1.1 | ≥1.4 | ≥2.0 | ||||
| Lbs/pous | ≥5.1 | ≥6.3 | ≥8.0 | ≥11.4 | |||||
| Pinholes & porosite | Nimewos | No | IPC-TM-650 2.1.2 | ||||||
| Anti-oksidasyon | RT (23°C) | Jou | 180 | / | |||||
| H.T.(200°C) | Minit | 40 | / | ||||||
Creole Lajè, 1295 (± 1) mm, ranje Lajè: 200-1340mm.Me selon demann kliyan tayè.
PCB Copper Foil Imaj
