Low Profile Ranvèse Trete Foil Copper Pou Chaje san fil
●Epesè: 12um 18um 35um 50um 70um
●Creole Lajè: 1290mm, ka koupe dapre demann gwosè
●Pake bwat an bwa
●ID: 76 mm, 152 mm
●Longè: Customized
●Low pwofil pou FCCL
●Segondè MIT
●Ekselan etchability
●Foil trete a woz oswa nwa
●Ranvèse trete papye kwiv
●Asenik-gratis, vèt
●2 kouch FPC
●EMI
●Telefòn mobil chaje san fil
| Klasifikasyon | Inite | Egzijans | Metòd tès | |||||
| Epesè nominal | Um | 12 | 18 | 35 | 50 | 70 | IPC-4562A | |
| Pwa Zòn | g/m² | 107±5 | 153±7 | 285± 10 | 435±15 | 585± 20 | IPC-TM-650 2.2.12.2 | |
| Pite | % | ≥99.8 | IPC-TM-650 2.3.15 | |||||
| brutality | Bò klere (Ra) | m | ≤3.0 | IPC-TM-650 2.3.17 | ||||
| Bò mat (Rz) | um | ≤3.0 | ≤4.0 | ≤6.0 | ≤8.0 | ≤10 | ||
| Fòs rupture | RT (23°C) | Mpa | ≥207 | ≥276 | IPC-TM-650 2.4.18 | |||
| HT (180 ° C) | ≥103 | ≥138 | ||||||
| Elongasyon | RT (23°C) | % | ≥4 | ≥4 | ≥8 | ≥10 | ≥12 | IPC-TM-650 2.4.18 |
| HT (180 ° C | ≥4 | ≥4 | ≥6 | ≥8 | ≥8 | |||
| Peel fòs (FR-4) | N/mm | ≥0.7 | ≥0.8 | ≥1.0 | ≥1.2 | ≥1.3 | IPC-TM-650 2.4.8 | |
| Lbs/pous | ≥4.0 | ≥4.6 | ≥5.7 | ≥6.9 | ≥7.4 |
| ||
| Pinholes & Porosite | Nimewo | No | IPC-TM-650 2.1.2 | |||||
| Anti-oksidasyon | RT (23°C) | Dwi | 180 | |||||
| HT (200 ° C) | Minit | 60 | ||||||
Estanda Lajè, 1295(±1)mm, ranje Lajè: 200-1340mm.Me selon demann kliyan tayè.
